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Water Guided Laser Cutting for Thick Silicon Carbide Substrate with Flip Cutting

Product Specifications Select Now
Model
Five-axis
Product Details
Customization: Available
After-sales Service: Support
Application: Aerospace Industry, Automotive Industry
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  • Water Guided Laser Cutting for Thick Silicon Carbide Substrate with Flip Cutting
  • Water Guided Laser Cutting for Thick Silicon Carbide Substrate with Flip Cutting
  • Water Guided Laser Cutting for Thick Silicon Carbide Substrate with Flip Cutting
  • Water Guided Laser Cutting for Thick Silicon Carbide Substrate with Flip Cutting
  • Water Guided Laser Cutting for Thick Silicon Carbide Substrate with Flip Cutting
  • Water Guided Laser Cutting for Thick Silicon Carbide Substrate with Flip Cutting
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  • Overview
  • Product Description
  • Product Parameters
  • Detailed Photos
  • FAQ
Overview

Basic Info.

Model NO.
Five-Axis Precision Cutting Machine
Cooling System
Air Cooling
Technical Class
Pulse Laser
Applicable Material
Metal
Structure Type
Gantry Type
Laser Classification
Solid Laser
Laser Technology
Water-Guided
Product Name
Five-Axis Precision Cutting Machine
Keywords
Laser Cutting Machine
Main Unit Shape
1.7m X 1.22m X 2.14m
Laser Source
Pulsed Solid-State Green Light 100~400W
Power Supply
3-Phase 5-Wire, 380V 5%, 50Hz +5%
Mechanical Engineering
Mineral Casting Base
Translational a-Axis
200mmx80mmx100mm
Rotary a-Axis
±110
Rotary C-
360°
Transport Package
Standard Packaging or Customized
Specification
Standard Specifications or Customized
Trademark
CONOVO
Origin
Jiangsu, China
Production Capacity
1000pieces/Yaer

Product Description

Water Guided Laser Cutting for Thick Silicon Carbide Substrate with Flip Cutting
Product Description
Water Guided Laser Cutting for Thick Silicon Carbide Substrate with Flip Cutting
FIVE-AXIS PRECISION WATER-GUIDED LASER CUTTING MACHINE
 
With our state-of-the-art 5-axis laser micro-jet cutting system. This innovative machine combines high-power laser technology with water-jet guided cutting, delivering unparalleled precision, minimal heat-affected zones, and superior edge quality for complex 3D geometries.
Engineered for industries demanding the highest accuracy, our five-axis CNC laser cutting machine excels in processing hard-to-cut materials including titanium alloys, superalloys, ceramics, composites, and hardened metals.
The integrated micro-jet technology effectively cools the cutting zone, eliminates thermal damage, and removes debris in real-time — ensuring burr-free, ultra-clean cuts.
PROCESSING APPLICATION FIELDS
Microelectronics/Aerospace
Si, Ge, SiC, GaAs,InP GaP CdTe, SiGe, Etc.
 
Diamonds And Other Gemstones
 
Metal
Al, Fe, Au, Ag, Cu, CuBe, Mg, W, WC, CuW, Mb, Ni, Ti, Co, Cr
 
Composite Materials
Carbon Fiber Reinforced Composites, CMC (Ceramic Matrix Polymer Composites)
 
Ceramic Materials/Hard Alloys
AlN, AlO, SiN, AlTiC, LTC C, ZrO, CBN, PCD
Product Parameters
TECHNICAL PARAMETERS
Cutting Area
Translational A-Axis
200mmX80mmX100mm
Rotary A-Axis
±110
Rotary C-
360°
Main Unit Shape
1.7M X 1.22M X 2.14M
Laser Source
Pulsed Solid-State Green Light 100~400W
Power Supply
3-Phase 5-Wire, 380V 5%, 50Hz +5%
Drive Method
Linear Motor With Grating Full Closed-Loop Servo Control, Cradle-Type Direct Drive Dual Rotary Table
Equipment Control
Independently Developed Dedicated CNC System And Process System
Mechanical Engineering
Mineral Casting Base
Detailed Photos
Water Guided Laser Cutting for Thick Silicon Carbide Substrate with Flip Cutting
Water Guided Laser Cutting for Thick Silicon Carbide Substrate with Flip Cutting
FIVE-AXIS SIMULTANEOUS MOTION CONTROL 
LASER MICRO-JET TECHNOLOGY 
Enables complex 3D cutting, angled drilling, and contour machining without workpiece repositioning; processes intricate geometries with full rotational freedom.
Combines focused laser beam with a fine water jet; the water stream guides the laser, cools the material instantly, and flushes away debris for clean, precise cuts.
Water Guided Laser Cutting for Thick Silicon Carbide Substrate with Flip Cutting
Water Guided Laser Cutting for Thick Silicon Carbide Substrate with Flip Cutting
MINIMAL HEAT-AFFECTED ZONE 
BURR-FREE & DROSS-FREE EDGES
Water-jet cooling dramatically reduces thermal damage, preventing material warping, micro-cracks, and metallurgical changes in heat-sensitive materials.
Produces smooth, high-quality cut surfaces requiring minimal or no post-processing; reduces secondary finishing time and costs.
Water Guided Laser Cutting for Thick Silicon Carbide Substrate with Flip Cutting
Water Guided Laser Cutting for Thick Silicon Carbide Substrate with Flip Cutting
Water Guided Laser Cutting for Thick Silicon Carbide Substrate with Flip Cutting
Water Guided Laser Cutting for Thick Silicon Carbide Substrate with Flip Cutting
FAQ
Q1: Are you a factory or a trader?
A: We are a manufacturer integrating industry and trade. Welcome to visit our company.
 
Q2: Can I add my LOGO to the product?
A: We support on-demand customization, including LOGO customization, color customization, appearance size customization, etc.
 
Q3: What payment methods do you support?
A: We support T/T, Western Union, PayPal, cash, etc. The details can be negotiated.
 
Q4: What are your modes of transportation?
A: We usually choose the appropriate mode of transportation (sea, air, land) according to the conditions of the goods, or we can choose the mode of transportation according to your requirements.
 
Q5: How can I get an accurate quotation?
A: You can first send your specific demand information and product pictures, and we will customize a solution for you according to your needs and inform you of the specific price.

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