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Advanced Sic Wafer Cutting Services Using Water Laser Method

  • Audited Supplier
  • 2 yrs

Product Specifications

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Product Highlights

  • Zero Thermal Damage: Heat affected zone within 5 microns, material properties preserved.
  • No Chipping or Cracking: Intact edges and no micro cracks on brittle materials.
  • High Aspect Ratio Micro Holes: Small deep holes in one pass, uniform and smooth.
  • Low Material Waste: Narrow kerf saves costly materials such as diamond and SiC.
  • Applications: Semiconductor, advanced packaging, aerospace, medical and superhard materials.
  • Flip Cutting for Thick Parts: Both sides cut in one setup, one third faster.
  • Stable Continuous Operation: Industrial-grade performance designed to reduce downtime and maintenance frequency for high throughput.
  • Green Light Laser Source: Pulsed solid-state green light laser with 100-400W power for high-accuracy micro-machining.

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Optional pre-shipment inspection for quality and quantity checks.
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Platform-assisted dispute resolution, including refunds or returns when applicable.

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Product Images of Advanced Sic Wafer Cutting Services Using Water Laser Method

Advanced Sic Wafer Cutting Services Using Water Laser Method
Advanced Sic Wafer Cutting Services Using Water Laser Method pictures & photos
Advanced Sic Wafer Cutting Services Using Water Laser Method
Advanced Sic Wafer Cutting Services Using Water Laser Method pictures & photos
Advanced Sic Wafer Cutting Services Using Water Laser Method
Advanced Sic Wafer Cutting Services Using Water Laser Method pictures & photos
Advanced Sic Wafer Cutting Services Using Water Laser Method
Advanced Sic Wafer Cutting Services Using Water Laser Method pictures & photos
Advanced Sic Wafer Cutting Services Using Water Laser Method
Advanced Sic Wafer Cutting Services Using Water Laser Method pictures & photos
Advanced Sic Wafer Cutting Services Using Water Laser Method
Advanced Sic Wafer Cutting Services Using Water Laser Method pictures & photos
Advanced Sic Wafer Cutting Services Using Water Laser Method
  • Advanced Sic Wafer Cutting Services Using Water Laser Method
  • Advanced Sic Wafer Cutting Services Using Water Laser Method
    Advanced Sic Wafer Cutting Services Using Water Laser Method
  • Advanced Sic Wafer Cutting Services Using Water Laser Method
    Advanced Sic Wafer Cutting Services Using Water Laser Method
  • Advanced Sic Wafer Cutting Services Using Water Laser Method
    Advanced Sic Wafer Cutting Services Using Water Laser Method
  • Advanced Sic Wafer Cutting Services Using Water Laser Method
    Advanced Sic Wafer Cutting Services Using Water Laser Method
  • Advanced Sic Wafer Cutting Services Using Water Laser Method
    Advanced Sic Wafer Cutting Services Using Water Laser Method
  • Advanced Sic Wafer Cutting Services Using Water Laser Method
    Advanced Sic Wafer Cutting Services Using Water Laser Method

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Product Description

Advanced Sic Wafer Cutting Services Using Water Laser Method
Product Description
Advanced Sic Wafer Cutting Services Using Water Laser Method
THREE-AXIS PRECISION WATER-GUIDED LASER CUTTING MACHINE
 
A three-axis precision water-guided laser cutting machine that combines high-accuracy laser processing with water-jet guidance to deliver ultra-fine cuts, smooth edges, and minimal thermal damage.
Designed for precision manufacturing, this advanced laser cutting system offers stable performance, flexible three-axis motion control, and clean, burr-free results on delicate or complex materials.
Ideal for users searching for high-precision laser cutting, water jet guided laser technology, and automated three-axis CNC cutting solutions.
USE
Precision manufacturing and micro-machining of components requiring high dimensional accuracy and fine details.

Cutting of delicate and heat-sensitive materials where conventional laser cutting may cause burning, warping, or cracking.

Production of complex 2D/3D contours in small and medium-sized parts across electronics, medical devices, and instrumentation.

High-value, high-reliability parts processing, such as prototypes, custom components, and small-batch precision parts.

Industries needing clean, high-quality edges, including semiconductor packaging, optical components, and advanced materials processing.
Product Parameters
TECHNICAL PARAMETERS
Cutting Material Specifications
320mmx320mm
Dimension
1.8mx1.26mx2m
Laser Source
Pulsed Solid-State Green Light 100–400 W
Power Supply
3-Phase, 5-Wire System, 380V ±5%, 50Hz ±5%
Driving Mode
Linear Motor With Grating Full-Closed-Loop Servo Control
Equipment Control
Independently Developed Dedicated CNC System And Process System
Mechanical Engineering
Mineral Cast Base
Detailed Photos
Advanced Sic Wafer Cutting Services Using Water Laser Method
Advanced Sic Wafer Cutting Services Using Water Laser Method
ADVANCED THREE-AXIS CNC MOTION CONTROL
WATER-GUIDED LASER CUTTING TECHNOLOGY FOR ULTRA-FINE, CLEAN EDGES
Enables precise, synchronized movement across three axes for complex cutting paths, multi-level structures, and 3D surface processing. Supports high positioning accuracy and repeatability, 
Uses a focused laser beam guided by a thin water jet to achieve an extremely narrow kerf and smooth cutting edges. The water jet helps to stabilize the laser path, reducing beam divergence and improving cutting precision on micro-scale features.
Advanced Sic Wafer Cutting Services Using Water Laser Method
Advanced Sic Wafer Cutting Services Using Water Laser Method
MINIMAL HEAT-AFFECTED ZONE AND REDUCED THERMAL DAMAGE
STABLE, INDUSTRIAL-GRADE PERFORMANCE FOR CONTINUOUS OPERATION
The water jet acts as an effective cooling medium, quickly dissipating heat from the cutting area. This significantly minimizes the heat-affected zone, preventing burning, warping, or micro-cracks on heat-sensitive materials.
Designed with a rigid mechanical structure and high-stability components to maintain precision over long production runs. Reduces downtime and maintenance frequency, helping manufacturers achieve higher throughput and lower overall production costs.
Advanced Sic Wafer Cutting Services Using Water Laser Method
Advanced Sic Wafer Cutting Services Using Water Laser Method
Advanced Sic Wafer Cutting Services Using Water Laser Method
Advanced Sic Wafer Cutting Services Using Water Laser Method
FAQ
Q1: Are you a factory or a trader?
A: We are a manufacturer integrating industry and trade. Welcome to visit our company.
 
Q2: Can I add my LOGO to the product?
A: We support on-demand customization, including LOGO customization, color customization, appearance size customization, etc.
 
Q3: What payment methods do you support?
A: We support T/T, Western Union, PayPal, cash, etc. The details can be negotiated.
 
Q4: What are your modes of transportation?
A: We usually choose the appropriate mode of transportation (sea, air, land) according to the conditions of the goods, or we can choose the mode of transportation according to your requirements.
 
Q5: How can I get an accurate quotation?
A: You can first send your specific demand information and product pictures, and we will customize a solution for you according to your needs and inform you of the specific price.

About the Supplier

This supplier has been audited by BV. Verify the report on the official BV website with ID "MIC-ASI2541752". Items marked "verified" are certified.

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Changzhou CONOVO CNC Tech. Co., Ltd.
Changzhou CONOVO CNC Tech. Co., Ltd.
Changzhou CONOVO CNC Tech. Co., Ltd.
Changzhou CONOVO CNC Tech. Co., Ltd.
Changzhou CONOVO CNC Tech. Co., Ltd.
Changzhou CONOVO CNC Tech. Co., Ltd.
Changzhou CONOVO CNC Tech. Co., Ltd.
Changzhou CONOVO CNC Tech. Co., Ltd.

About Our Factory & Business Background

verified Business Type
Manufacturer/Factory & Trading Company
Address
Address
verified Plant Area
4415 square meters
verified Number of Employees
26
verified Registered Capital
1,322,750 RMB
verified Terms of Payment
LC, T/T, D/P, PayPal, Western Union, Small-amount payment
verified International Commercial Terms(Incoterms)
FOB, CIF, CFR, EXW
verified Average Lead Time
Peak Season Lead Time: one month
Off Season Lead Time: one month
verified Nearest Port
Shanghai Port
verified Minimum Order Quantity
1 Set
verified Supply Chain Partners
48

Our Production Capability & Technical Expertise

verified Main Products
Water-Guided Laser Cutting Machine, Fiber Laser Cutter
verified Production Lines
1
verified Production Machines
Lathing Facility, Milling Facility
verified QA/QC inspectors
2 people
verified Inspection Type for Finished Products
100% inspection(Visual inspection & Function inspection)
verified Inspection Method for Finished Products
Have instructions and uniformly followed
verified Customization Options
Customization from Samples, Customization from Designs, Full Customization, Minor Customization, Flexible customization
verified ODM Service Available
Yes
verified OEM Service Available
Yes
verified R&D Engineers
6 people
verified Traceability of Raw Materials
Yes

Our Industry Experience & Global Business Record

verified Year of Establishment
2014-04-04
verified Export Year
2 Years
verified Main Markets
Domestic
verified Repeat Buyers Choice
80%~100%
verified Number of Foreign Trading Staff
2
verified Overseas Agent/Branch
No
verified New Products Launched in Last year
Yes

Our Certifications, Standards & Industry Recognition

verified Cooperated with Fortune 500
No

FAQ

Are you a factory or a trader?
We are a manufacturer integrating industry and trade. Welcome to visit our company.
Can I add my LOGO to the product?
We support on-demand customization, including LOGO customization, color customization, appearance size customization, etc.
What payment methods do you support?
We support T/T, Western Union, PayPal, cash, etc. The details can be negotiated.
What are your modes of transportation?
We usually choose the appropriate mode of transportation (sea, air, land) according to the conditions of the goods, or we can choose the mode of transportation according to your requirements.
How can I get an accurate quotation?
You can first send your specific demand information and product pictures, and we will customize a solution for you according to your needs and inform you of the specific price.

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